innovative thermoelectric control for deep cooling applications ICECAP Cooling Explore

ICECAP, an acronym for Thermo-Electric Cooling for Electronics Applications, enables cooling for compact systems with drastically lower power consumption.

Our core technologies allow integration with various products, features and services – all leading towards our vision of controlled cooling

The Problem

Current cooling methods are too large, inefficient, or imprecise for portable products. Thermoelectric systems suffer from low co-efficient of performance, worsened at micro-scale sizes by:

Poor modeling

Brought about by setup complexity of multistack TEMs

Environmental changes

Negating original intended design at one particular operating point

Inadequate isolation

Usually brought about by limited space

ICECAP overcomes these challenges through

Dynamic Hardware-in-the-Loop Optimisation

Our patented technology improves power efficiency by tracking the optimal TEM stack operation

Electronic Systems Design

Expertise in electronic design for data acquisition, power management and digital processing for cooling systems

Innovative Thermal Isolation

Our patented thermal guard ring and vacuum isolation methods maximise temperature drop without increasing size.

Compact Thermal Dissipation

Heatsink expertise delivers precise cooling solutions not usually available in the market
Discover More about Our Patented Technologies

ICECAP’s solutions provide up to 30% better efficiency than normal stacked modules

making thermoelectric adoption feasible in scenarios once considered impractical

Single peltier solution, 200W
3 Stack Solution, 140W
ICECAP 3 stack solution, 105W

Core Product Platform

Enables rapid adoption of the core technologies. Includes system devices and elements such as:

  • Our TEC Controller is a compact solution delivering patent-pending control algorithms to support up to four peltier devices. The tabletop or DIN rail mounted module promises seamless plug-and-play thermoelectric cooling to any system.
  • Validated TEC stacks assemblies and sub-mounts
  • Hermetic package sub-assembly
  • Heatsink for hermetic package sub-assembly

ODM and Custom Integration

Provides tailor made accessibility to the core technologies and/or core product platform. These are developed in response to specific customer requirements. Talk to us !

Press

ICECAP Finalist in Electronica 2024’s Fast Forward Competition

ICECAP Systems is proud to be named a top-five finalist in the Electronica Fast Forward competition 2024. This selection highlights our Aristat Controller Quad, built for efficient cooling in compact and portable electronics, amongst other offerings. Electronica is the world’s stage for electronics innovation. This confirms our commitment to smart, next-generation cooling solutions, and we’re…

Read more

Awards and partners

Interested in Knowing More?

Contact us to know more about ICECAP and how our technologies can be used in your next cooling system.

+356 79630101