innovative thermoelectric control for deep cooling applications ICECAP Cooling Explore

ICECAP, an acronym for Thermo-Electric Cooling for Electronics Applications, enables cooling for compact systems with drastically lower power consumption.

Our core technologies allow integration with various products, features and services – all leading towards our vision of controlled cooling

The Problem

Current cooling methods are too large, inefficient, or imprecise for portable products. Thermoelectric systems suffer from low co-efficient of performance, worsened at micro-scale sizes by:

Poor modeling

Brought about by setup complexity of multistack TEMs

Environmental changes

Negating original intended design at one particular operating point

Inadequate isolation

Usually brought about by limited space

ICECAP overcomes these challenges through

Dynamic Hardware-in-the-Loop Optimisation

Our patented technology improves power efficiency by tracking the optimal TEM stack operation

Electronic Systems Design

Expertise in electronic design for data acquisition, power management and digital processing for cooling systems

Innovative Thermal Isolation

Our patented thermal guard ring and vacuum isolation methods maximise temperature drop without increasing size.

Compact Thermal Dissipation

Heatsink expertise delivers precise cooling solutions not usually available in the market

ICECAP’s solutions provide up to 30% better efficiency than normal stacked modules

making thermoelectric adoption feasible in scenarios once considered impractical

Single peltier solution, 200W
3 Stack Solution, 140W
ICECAP 3 stack solution, 105W

Core Product Platform

Enables rapid adoption of the core technologies. Includes system devices and elements such as:

  • Our TEC Controller is a compact solution delivering patent-pending control algorithms to support up to four peltier devices. The tabletop or DIN rail mounted module promises seamless plug-and-play thermoelectric cooling to any system.
  • Validated TEC stacks assemblies and sub-mounts
  • Hermetic package sub-assembly
  • Heatsink for hermetic package sub-assembly

ODM and Custom Integration

Provides tailor made accessibility to the core technologies and/or core product platform. These are developed in response to specific customer requirements. Talk to us !

Press

ICECAP Systems Joins ChipStart EU Programme at GCSM 2025

On the 10th of November, ICECAP Systems reached another pivotal moment in its commercial journey. The team attended the Global Semiconductor Conference Malta (GCSM) and pitched alongside 12 other selected startups. This event marked the official announcement that ICECAP has joined the prestigious ChipStart EU programme. The Pitch at GCSM 2025 The pitch took place…

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ICECAP Systems showcases its tech at TECHXPO 2025

ICECAP Systems joined Malta’s leading technology companies at TECHXPO 2025, held from November 20th to 22nd. The event, hosted at the Malta Fairs and Conventions Centre (MFCC) in Ta’ Qali, served as a showcase for the island’s growing digital ecosystem. Organised by the Ministry for the Economy, Enterprise and Strategic Projects in collaboration with the…

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GLACIER wins Outstanding Technological Innovation at R&I Expo 2025

At the R&I Expo 2025, our Go-To-Market project GLACIER took first place in the Outstanding Technological Innovation award category. The 2025 R&I Expo took place on November 19 and 20. Organised by Xjenza Malta, the event brought together Malta’s brightest researchers, policymakers, and industry leaders. This year showcased over 35 projects funded through various national…

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We joined the launch of SUSTENET (COST Action CA24120)

On 24 October 2025, we attended the Brussels kick-off of SUSTENET – the Sustainable Thermoelectrics European Network (COST Action CA24120). The Action runs from 2025 to 2029 and is built to accelerate sustainable, industry-ready thermoelectrics in both waste-heat recovery and active cooling. COST Actions fund the networking that moves ideas faster: meetings, training schools, and…

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ICECAP wins Pitch Black at Start Up Festival Malta 2025

We’re proud to share that ICECAP won first place in the Pre-Seed category of Pitch Black at this year’s Start Up Festival Malta ! The win fast-tracks our go-to-market plan for the Aristat Controller Quad, as well as other solutions coming up soon ! Pitch Black is the festival’s flagship, no-slides pitching competition. Founders have…

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Malta Furthers Chip Ambition with Competence Center Launch

Malta has launched the Malta Semiconductor Competence Center (MSCC), to grow chip design talent and innovation. The center is co-funded with €8 million over four years by European Chips JU and Malta Enterprise. It brings together the University of Malta, MCAST, MDIA, and Silicon Catalyst, with support from IMEC and Arm. Nitin Dahad , chief…

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Awards and partners

Interested in Knowing More?

Contact us to know more about ICECAP and how our technologies can be used in your next cooling system.

+356 79630101